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  d a t a sh eet product data sheet 2003 nov 11 discrete semiconductors BAT54CM schottky barrier double diode m3d883
2003 nov 11 2 nxp semiconductors product data sheet schottky barrier double diode BAT54CM features ? low forward voltage ? leadless ultra small plastic package (1.0 0.6 0.5 mm) ? boardspace 1.17 mm 2 (approx. 10% of sot23) ? power dissipation comparable to sot23. applications ? ultra high-speed switching ? voltage clamping ? protection circuits ? mobile communications, digital (still) cameras, pdas and pcmcia cards. description planar schottky barrier double diode encapsulated in a sot883 leadless ultra small plastic package. marking pinning type number marking code BAT54CM s3 pin description 1 anode (a 1 ) 2 anode (a 2 ) 3 common cathode handbook, halfpage mle232 1 2 3 bottom view top view cathode mark 2 1 3 fig.1 simplified outline (sot883) and symbol. ordering information type number package name description version BAT54CM ? leadless ultra small plastic package; 3 solder lands; body 1.0 0.6 0.5 mm sot883
2003 nov 11 3 nxp semico nductors product data sheet schottky barrier double diode BAT54CM limiting values in accordance with the absolute maximum rating system (iec 60134). note 1. refer to sot883 standard mounting conditions (footprint); fr4 with 60 m copper strip line. thermal characteristics note 1. refer to sot883 standard mounting conditions (footprint), fr4 with 60 m copper strip line. soldering reflow soldering is the only recommended soldering method. electrical characteristics t amb = 25 c unless otherwise specified. note 1. pulsed test: t p 300 s; 0.02. symbol parameter conditions min. max. unit v r continuous reverse voltage ? 30 v i f continuous forward current ? 200 ma i frm repetitive peak forward current t p 1 s; 0.5 ? 300 ma i fsm non-repetitive peak forward current t p < 10 ms ? 600 ma t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c p tot total power dissipation (per package) t amb 25 c; note 1 ? 250 mw symbol parameter conditions value unit r th j-a thermal resistance from junction to ambient note 1 500 k/w symbol parameter conditions max. unit per diode v f forward voltage see fig.2; i f = 0.1 ma 240 mv i f = 1 ma 320 mv i f = 10 ma 400 mv i f = 30 ma 500 mv i f = 100 ma 800 mv i r continuous reverse current v r = 25 v; note 1; see fig.3 2 a c d diode capacitance f = 1 mhz; v r = 1 v; see fig.4 10 pf
2003 nov 11 4 nxp semico nductors product data sheet schottky barrier double diode BAT54CM handbook, halfpage 10 i f v f (v) 3 10 (ma) 2 10 1 10 1 1.2 0.8 0.4 0 msa892 (3) (2) (1) (3) (2) (1) fig.2 forward current as a function of forward voltage; typical values. (1) t amb = 125 c. (2) t amb = 85 c. (3) t amb = 25 c. 0102030 v (v) r 10 3 i r ( a) 10 2 10 1 10 1 (1) (2) (3) msa893 fig.3 reverse current as a function of reverse voltage; typical values. (1) t amb = 125 c. (2) t amb = 85 c. (3) t amb = 25 c. handbook, halfpage 0102030 0 5 10 15 v r (v) c d (pf) msa891 fig.4 diode capacitance as a function of reverse voltage; typical values. f = 1 mhz; t amb = 25 c.
2003 nov 11 5 nxp semico nductors product data sheet schottky barrier double diode BAT54CM package outline unit a 1 max. a (1) bb 1 e 1 ell 1 references outline version european projection issue date iec jedec jeita mm 0.50 0.46 0.20 0.12 0.55 0.47 0.03 0.62 0.55 0.35 0.65 dimensions (mm are the original dimensions) note 1. including plating thickness 0.30 0.22 0.30 0.22 sot883 sc-101 03-02-05 03-04-03 de 1.02 0.95 l e 2 3 1 b b 1 a 1 a d l 1 0 0.5 1 mm scale l eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm sot88 3 e e 1
2003 nov 11 6 nxp semico nductors product data sheet schottky barrier double diode BAT54CM data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors. no changes were made to the content, except for the legal definitions and disclaimers. printed in the netherlands r76/01/pp 7 date of release: 2003 nov 11 document order number: 9397 750 11909


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